IP & IC Design (IC設計/IP)MediaTek (聯發科)Novatek (聯詠)Realtek (瑞昱)Silergy (矽力-KY)Fitipower (天鈺)Nuvoton (新唐)AP Memory (愛普*)Alchip (世芯-KY)Global Unichip (創意)Faraday (智原)M31Parade (譜瑞-KY)GMT (致新)ARMSynopsys
Materials & Equipment (材料與設備)GlobalWafers (環球晶)SAS (中美晶)Kinik (中砂)Scientech (辛耘)Formosa Sumco (台勝科)CHPT (精測)WinWay (穎崴)VPEC (全新)Foxsemicon (京鼎)ASMLApplied MaterialsShin-Etsu
Packaging & Testing (封裝測試)ASE (日月光投控)PTI (力成)ChipMOS (南茂)KYEC (京元電)Sigurd (矽格)Tong Hsing (同欣電)Xintec (精材)
IP & IC Design (IC設計/IP)MediaTek (聯發科)Novatek (聯詠)Realtek (瑞昱)Silergy (矽力-KY)Fitipower (天鈺)Nuvoton (新唐)AP Memory (愛普*)Alchip (世芯-KY)Global Unichip (創意)Faraday (智原)M31Parade (譜瑞-KY)GMT (致新)ARMSynopsys
Materials & Equipment (材料與設備)GlobalWafers (環球晶)SAS (中美晶)Kinik (中砂)Scientech (辛耘)Formosa Sumco (台勝科)CHPT (精測)WinWay (穎崴)VPEC (全新)Foxsemicon (京鼎)ASMLApplied MaterialsShin-Etsu
Packaging & Testing (封裝測試)ASE (日月光投控)PTI (力成)ChipMOS (南茂)KYEC (京元電)Sigurd (矽格)Tong Hsing (同欣電)Xintec (精材)